Method for encapsulating electronic conductors

Details Method for encapsulating electronic conductors Method for encapsulating electronic conductors

1993-08-04

1996-04-23

Lovering, Richard D.

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

174110S, 174114R, 174115, 174251, 427120, 439936, B05D 720, H01B 702

Patent

active

055101534

ABSTRACT:
Glass particles (14) are mixed within an uncured silicone resin (13). The fluid uncured resin is placed in a portion of a terminal block (11) and cured to form a gel (13') by subjecting it to microwaves in a microwave oven (22). Conductors (25, 26) to be interconnected are next inserted into the cured silicone gel and interconnected. The cured gel containing the glass particles thereafter constitutes a dependable insulator for the conductors, particularly the portions of the conductors that are interconnected.

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