Method for encapsulating electronic components or assemblies usi

Details Method for encapsulating electronic components or assemblies usi Method for encapsulating electronic components or assemblies usi

1990-01-16

1992-04-21

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437215, 437217, 437219, 437220, H01L 2152, H01L 2156, H01L 2158, H01L 2160

Patent

active

051067854

ABSTRACT:
A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.

REFERENCES:
patent: 3706840 (1972-12-01), Moyle et al.
patent: 4701999 (1987-10-01), Palmer

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