Method for encapsulating an integrated semi-conductor circuit

Details Method for encapsulating an integrated semi-conductor circuit Method for encapsulating an integrated semi-conductor circuit

1997-06-10

1999-04-27

Powell, William

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

438123, 438127, 216 33, H01L 2100

Patent

active

058973389

ABSTRACT:
Method for encapsulating an integrated semi-conductor circuit (die) comprising the following steps:
a) mounting the semi-conductor circuit onto the surface of a so-called lead frame,
b) attaching connecting wires between the contact surfaces of the semi-conductor circuit and selected parts of the lead frame (bonding operation),
c) by means of a mould producing a plastic housing which at least encapsulates the semi-conductor circuit, the supporting surface, the bonding wires and part of the lead frame,
d) the mould comprises an inwards extending section of which the end surface in the closed situation of the mould extends parallel to the free upper side of the integrated semi-conductor circuit at short distance thereof, and
e) before closing the mould a layer of heat resistant deformable material in the form of a ring or a continuous layer is brought in between the upper side of the integrated semi-conductor circuit and said end surface of the inwards extending part, which layer not or hardly adheres to the plastic housing.

REFERENCES:
patent: 4894707 (1990-01-01), Yamawaki et al.
patent: 5483740 (1996-01-01), Maslakow

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