Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1995-05-03
1999-01-26
Graybill, David
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
438116, 438117, 438124, 438126, 438127, H01L 2156, H01L 2158
Patent
active
058638105
ABSTRACT:
A method for encapsulating an integrated semiconductor circuit. The semiconductor circuit is mounted onto the support surface of a so-called lead frame. Connecting wires are attached between the contact pads of the semiconductor circuit and selected parts of the lead frame. A predetermined volume of radiation-transparent plastic is supplied at a side of the semiconductor circuit opposite the side which is attached to the supporting surface, which plastic has a glass temperature lower than the temperature which is used for carrying out step c). A plastic package is produced by means of a mould, which package surrounds at least the semiconductor circuit, the supporting surface, the connecting wires and part of the lead frame.
REFERENCES:
patent: 3778685 (1973-12-01), Kennedy
patent: 4649418 (1987-03-01), Uden
patent: 4881885 (1989-11-01), Kovac et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5036024 (1991-07-01), Mine et al.
patent: 5045918 (1991-09-01), Cagan et al.
patent: 5057457 (1991-10-01), Miyahara et al.
patent: 5200367 (1993-04-01), Ko
patent: 5331205 (1994-07-01), Primeaux
patent: 5379186 (1995-01-01), Gold et al.
patent: 5534725 (1996-07-01), Hur
patent: 5585600 (1996-12-01), Froebel et al.
Euratec B.V.
Graybill David
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