Method for encapsulating an electronic component using a...

Details Method for encapsulating an electronic component using a... Method for encapsulating an electronic component using a...

2003-05-12

2008-09-16

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S121000, C438S106000, C438S123000, C438S124000, C257S676000, C257S787000, C257SE23127, C257SE23116, C257SE23125

Reexamination Certificate

active

07425469

ABSTRACT:
The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer with the side remote from the component, and c) encapsulating the electronic component with encapsulating material, wherein the foil layer undergoes a treatment whereby the adhesion of the foil layer is increased such that it adheres to the carrier. The invention also relates to a foil material for applying during such a method.

REFERENCES:
patent: 6033933 (2000-03-01), Hur
patent: WO 00 66340 (2000-11-01), None
patent: WO 01 69669 (2001-09-01), None

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