Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Chemically responsive
Patent
1995-03-29
1997-09-09
Niebling, John
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Chemically responsive
438126, 26427217, H01L 2504, H01L 2516, H01L 2331
Patent
active
056656530
ABSTRACT:
An electrochemical sensor assembly which allows a solution to make contact with an active sensing area of a sensor, while constraining the solution such that the fluid does not contact the sensor electronics and a method for fabricating such a sensor assembly. A sensor assembly is fabricated in accordance with a simple process, including: fabricating a master pattern which matches the external profile of an epoxy shell which will encapsulate a substrate upon which the sensors are mounted; forming a flexible tool (or mold) which conforms to the general profile of the master pattern; placing sensors together with any other desired electronic circuitry on a substrate (such as a printed circuit board or a ceramic pad to form a "hybrid"); pressing a number of electrical contact points on the hybrid and the active sensing area of each sensor on the substrate into contact with flexible protrusions of the flexible tool; and potting the hybrid. Due to the fact that the protrusions from the flexible tool are in contact with the hybrid and structures thereon, a seal is formed to prevent potting material from contacting and covering the predetermined areas of the hybrid covered by the protrusions from the flexible tool.
REFERENCES:
patent: 4233136 (1980-11-01), Spaziani et al.
patent: 4366038 (1982-12-01), Kearney et al.
patent: 4496512 (1985-01-01), Marsoner et al.
patent: 4505799 (1985-03-01), Baxter
patent: 4519973 (1985-05-01), Cahalan et al.
patent: 4534825 (1985-08-01), Koning et al.
patent: 5068205 (1991-11-01), Baxter et al.
patent: 5091341 (1992-02-01), Asada et al.
patent: 5121289 (1992-06-01), Gagliardi
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5139969 (1992-08-01), Mori
patent: 5147821 (1992-09-01), McShane et al.
patent: 5179039 (1993-01-01), Ishida et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5527743 (1996-06-01), Variot
patent: 5550711 (1996-08-01), Burns et al.
Cobben, Peter L.H.M., "Chemically Modified Ion-Sensitive Field-Effect Transistors": Application in Flow-Injection Analysis Cells without Polymeric . . . Analytica Chimica Acta, vol. 248, 1991, pp. 307-313.
Shiono, Satoru, "A Flow--Through Cell for Use with an Enzyme-Modified Field Effect Transistor without Polymeric Encapulation and Wire Bonding", Analytica Chimica Acta, vol. 202, 1987, pp. 131-140.
Bare Rex O.
Scherer Andy
Kirkpatrick Scott
Niebling John
Unifet Incorporated
LandOfFree
Method for encapsulating an electrochemical sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for encapsulating an electrochemical sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for encapsulating an electrochemical sensor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-69602