Method for encapsulating an electrical component

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S108000, C438S112000, C438S127000

Reexamination Certificate

active

07094626

ABSTRACT:
An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.

REFERENCES:
patent: 6124636 (2000-09-01), Kusamitsu
patent: 6408511 (2002-06-01), Branchevsky
patent: 6417026 (2002-07-01), Gotoh et al.
patent: 6722030 (2004-04-01), Stelzel et al.
patent: 0794 616 (1997-09-01), None
patent: 1 0168 041 (1998-06-01), None
patent: WO 99/43084 (1999-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for encapsulating an electrical component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for encapsulating an electrical component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for encapsulating an electrical component will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3608688

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.