Method for encapsulating an electrical component

Details Method for encapsulating an electrical component Method for encapsulating an electrical component

2006-08-22

2006-08-22

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S112000, C438S127000

Reexamination Certificate

active

07094626

ABSTRACT:
An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.

REFERENCES:
patent: 6124636 (2000-09-01), Kusamitsu
patent: 6408511 (2002-06-01), Branchevsky
patent: 6417026 (2002-07-01), Gotoh et al.
patent: 6722030 (2004-04-01), Stelzel et al.
patent: 0794 616 (1997-09-01), None
patent: 1 0168 041 (1998-06-01), None
patent: WO 99/43084 (1999-08-01), None

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