Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-05-10
2011-05-10
Sefer, A. (Department: 2893)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C257S082000, C257S088000, C257SE33001, C257SE21001, C257SE23116
Reexamination Certificate
active
07939350
ABSTRACT:
The present invention relates to a method for encapsulating a substrate, which comprises:(a1) providing a substrate with a plurality of chips mounted on a top of the substrate;(b1) compressing a dry film photoresist on the top side of the substrate to form a photoresist layer;(c1) exposing the photoresist layer to a light source through a mask to form unexposed photoresist regions and exposed photoresist regions;(d1) developing the photoresist layer to uncover underlying portions of the unexposed photoresist regions;(e1) molding the top side of the substrate with a molding material;(f1) curing the molding material; and(g1) removing the unexposed photoresist regions from the substrate with a photoresist-removing agent.
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E. I. Du Pont de Nemours and Company
Harrison Monica D
Kaeding Konrad H.
Sefer A.
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