Method for encapsulating a radial leaded electrical component

Details Method for encapsulating a radial leaded electrical component Method for encapsulating a radial leaded electrical component

1981-11-27

1983-03-22

Lowe, James B.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427215, 26427218, 264278, B29C 604

Patent

active

043775489

ABSTRACT:
A large multi-cavity mold is loaded with a plurality of horizontal radially leaded capacitors. The closed mold grips the leads. A top knock-out pin pushes each component body downward a predetermined degree so that all the bodies are left in about the same position within the corresponding mold cavity. A bottom knock-out pin then pushes each component body upward only slightly above the cavity center so that upon its withdrawal, the programmed lead wire stresses cause the bodies to spring back just to the mold cavity center position. Molding resin is then introduced into the cavities. The incidence of show-throughs is greatly reduced.

REFERENCES:
patent: 3044127 (1962-07-01), Alden
patent: 3436610 (1969-04-01), Sparrow et al.

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