Method for encapsulating a plurality of electronic components

Details Method for encapsulating a plurality of electronic components Method for encapsulating a plurality of electronic components

2007-05-01

2007-05-01

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

10765584

ABSTRACT:
A method for encapsulating the electronic component and a method for producing electronic components according to the method include coating the component with a coating material. The coating material is hardened and an assembly including the component and the coating is encapsulated in plastic. In particular, the coating can be accomplished by immersion. The electronic component includes the coating encapsulation of a coating material applied in a flowable condition and hardened and a plastic encapsulation encapsulating the coating.

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patent: 5167556 (1992-12-01), Stein
patent: 6560110 (2003-05-01), Myers et al.
patent: 2003/0170450 (2003-09-01), Stewart et al.
patent: 199 40 458 (2001-03-01), None
patent: 0 464 394 (1992-01-01), None
patent: 01/14610 (2001-03-01), None

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