Method for encapsulating a chip having a sensitive surface

Details Method for encapsulating a chip having a sensitive surface Method for encapsulating a chip having a sensitive surface

2007-12-25

2007-12-25

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S116000, C438S124000, C438S126000, C438S127000, C257S787000, C257SE23116, C257SE21504

Reexamination Certificate

active

10472907

ABSTRACT:
Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to keep the space above the sensitive surface of the chip free during the encapsulation process, closing the mould with a second mould part, introducing the package material into the closed mould and providing the circumstances to let the package cure. The method also including applying a closed dam of heat resistant material around the sensitive chip area and placing a lid on the dam such that space above the sensitive area enclosed by the dam and the lid is sealed.

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