Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2007-04-17
2007-04-17
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S055000, C438S064000, C438S127000, C438S048000
Reexamination Certificate
active
10490945
ABSTRACT:
Method for encapsulating a chip with encapsulant, one portion of the surface of which chip must remain free of encapsulant, comprising the following steps: fixing the chip on a carrier with a suitable conductor structure, placing carrier and chip in one part of a mould, positioning a material on the mould or the chip surface, such that this material is clamped between the chip and mould after the mould has been closed, closing the mould, introducing the encapsulant and at least partially curing the encapsulant. The material is a heat-resistant moulding, having dimensions in the directions parallel to the surface of the chip such that an accurately delimited portion of the chip surface will be covered when the mould is closed, and a dimension in the direction perpendicular to the chip surface determined by the distance between the mould surface and the free portion of the chip surface.
REFERENCES:
patent: 4894707 (1990-01-01), Yamawaki et al.
patent: 5622873 (1997-04-01), Kim et al.
patent: 5862248 (1999-01-01), Salatino et al.
patent: 5897338 (1999-04-01), Kaldenberg
patent: 6187243 (2001-02-01), Miyajima
patent: 6300169 (2001-10-01), Weiblen et al.
patent: 6667439 (2003-12-01), Salatino et al.
patent: 6811738 (2004-11-01), Magni et al.
patent: 6860731 (2005-03-01), Ho et al.
patent: 1 220 309 (2002-07-01), None
patent: 1 003 315 (1997-12-01), None
patent: WO 01 84618 (2001-11-01), None
Patent Abstracts of Japan, vol. 1998, No. 08, Jun. 30, 1998—& JP 10 075040 A (Toshiba Chem Corp), Mar. 17, 1998 the whole document.
Patent Abstracts of Japan, vol. 012, No. 321 (M-736) Aug. 31, 1988—& JP 63 089313 A (TOK Corp), Apr. 20, 1988 the whole document.
Patent Abstracts of Japan vol. 008, No. 206 (E-267), Sep. 20, 1984—& JP 59 092534 A (Matsushita Denki Sangyo KK), May 28, 1984 the whole document.
Patent Abstracts of Japan vol. 1998, No. 03, Feb. 27, 1998—& JP 09 304211 A (Omron Corp), Nov. 28, 1997 the whole document.
Patent Abstracts of Japan vol. 1998, No. 06, Apr. 30, 1998—& JP 10 034699 A (APIC Yamada KK), Feb. 10, 1998 abstract.
Patent Abstracts of Japan, vol. 017, No. 214 (E-1357), Apr. 27, 1993—& JP 04 352435 A (Mitsubishi Electric Corp), Dec. 7, 1992 the whole document.
Elmos Advanced Packaging B.V.
Thai Luan
Young & Thompson
LandOfFree
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