Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-02-01
2008-09-02
Crispino, Richard (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C264S571000, C264S272160, C264S511000, C264S261000, C445S024000, C445S025000
Reexamination Certificate
active
07419565
ABSTRACT:
A method for encapsulating an area on a substrate comprising the steps of a) providing a substrate having an area on a surface thereof which is to be encapsulated, b) providing an assembly fixture which has features formed into the surface of the fixture, and vacuum orifices associated with the features of the fixture, c) positioning a substantially flat formable sheet onto the assembly fixture, and forming the sheet to the features of the assembly fixture by applying a negative pressure through the vacuum orifices, wherein corresponding features are formed in the sheet, d) patterning an adhesive onto the sheet or onto the substrate, the adhesive pattern corresponding to the perimeter of the area on the substrate to be encapsulated, e) clamping together the substrate and the sheet, causing the patterned adhesive to flow between the substrate and sheet in the area of compression, wherein the patterned adhesive is proximate to the features formed in the sheet, and f) curing the adhesive to form a perimeter seal between the substrate and the sheet.
REFERENCES:
patent: 4619624 (1986-10-01), Kerr et al.
patent: 6224706 (2001-05-01), Matich
patent: 6304308 (2001-10-01), Saito et al.
patent: 6373547 (2002-04-01), Saito et al.
patent: 6731369 (2004-05-01), Choo
patent: 2001/0022401 (2001-09-01), Nakamura
patent: 2002/0070663 (2002-06-01), Ogura et al.
patent: 2002/0121860 (2002-09-01), Seo et al.
patent: 2002/0155320 (2002-10-01), Park et al.
patent: 2003/0007117 (2003-01-01), McKnight et al.
patent: 2004/0095060 (2004-05-01), Ushifusa et al.
patent: 02/21557 (2002-03-01), None
Anderson Andrew J.
Crispino Richard
Eastman Kodak Company
Schatz Christopher
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