Method for encapsulated integrated circuits

Details Method for encapsulated integrated circuits Method for encapsulated integrated circuits

1998-09-23

2000-06-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438106, 438124, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

060717610

ABSTRACT:
Composition, method, and products for the environmental protection of integrated circuits comprising a robotically dispensible, wave solderable, low moisture absorbing urethane polymer reaction product of an aliphatic isocyanate, a flexibilizing low molecular weight rubbery polymer having isocyanate reactive hydroxyl terminals, and a diamine arranged to bodily encapsulate the integrated circuit within a dam of thixotropic version of the same polymer, the encapsulation being free of popcorning response to rapid heat rise after high humidity conditioning and otherwise superior as an IC encapsulant.

REFERENCES:
patent: 4326238 (1982-04-01), Takeda et al.
patent: 4529755 (1985-07-01), Nishikawa et al.
patent: 5070039 (1991-12-01), Johnson et al.

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