Method for electroplating on resistive substrates

Details Method for electroplating on resistive substrates Method for electroplating on resistive substrates

2005-12-13

2005-12-13

Koehler, Robert R. (Department: 1775)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal or alloy coating on...

C205S104000, C205S157000, C205S261000, C205S291000, C205S640000, C428S615000, C428S620000, C428S655000, C428S656000, C428S674000, C428S926000

Reexamination Certificate

active

06974531

ABSTRACT:
A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal. A structure is also provided that comprises a substrate, a platable metal barrier layer(s) located on the substrate and a relatively continuous uniform electroplated layer of a conductive material located on the platable resistive metal barrier layer.

REFERENCES:
patent: 5968333 (1999-10-01), Nogami et al.
patent: 6160315 (2000-12-01), Chiang et al.
patent: 6309969 (2001-10-01), Oskam et al.
patent: 6451448 (2002-09-01), Kanda et al.
patent: 6534116 (2003-03-01), Basol
patent: 2002/0104761 (2002-08-01), Birss et al.
patent: 2003/0057097 (2003-03-01), Tsai et al.

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