Chemistry: electrical and wave energy – Processes and products
Patent
1985-11-21
1987-07-28
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
29852, 156656, 1566591, 204 20, 204 30, 204 384, C25D 554
Patent
active
046830367
ABSTRACT:
Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component which causes the plating to preferentially occur at said sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out.
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Morrissey Denis M.
Takach Peter E.
Zeblisky Rudolph J.
Kollmorgen Technologies Corporation
Leader William T.
Niebling John F.
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