Method for electroplating metal onto a non-conductive substrate

Details Method for electroplating metal onto a non-conductive substrate Method for electroplating metal onto a non-conductive substrate

1992-10-30

1994-08-30

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Product produced by electrolysis involving electrolytic...

205159, 205118, 205125, 205126, 205205, 205210, 205183, 205917, 427457, 427532, 427 77, 427 98, 156901, 428901, C25D 500

Patent

active

053425014

ABSTRACT:
Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions.

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Matijevic, et al., "The Characterization of the Stannous Chloride/Palladium Chloride Catalysts for Electroless Plating", Reprinted from Oct. 1975, Plating and Surface Finishing.

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