Method for electroplating metal films including use a cathode ri

Details Method for electroplating metal films including use a cathode ri Method for electroplating metal films including use a cathode ri

1997-01-31

1998-04-28

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Controlling current distribution within bath

205 97, 205157, 204228, 204231, 204297R, 118624, 118625, 118500, C25D 500, C25D 712, C25B 1500, B05B 5025

Patent

active

057440190

ABSTRACT:
Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially uniform using a cathode assembly on which the substrate wafer is mounted. The cathode assembly includes an inner cathode ring electrically connected to the wafer, a thief ring external to the cathode ring and an insulating ring connected between and electrically insulating the cathode and thief rings. The cathode ring and the thief ring are powered by separate power sources.

REFERENCES:
patent: 3880725 (1975-04-01), Van Raalte et al.
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4696729 (1987-09-01), Santini
patent: 5078852 (1992-01-01), Yee et al.
patent: 5312532 (1994-05-01), Andricacos et al.

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