Method for electrolytic copper plating

Details Method for electrolytic copper plating Method for electrolytic copper plating

2005-12-20

2005-12-20

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating process fluid by means other than agitation or...

C205S101000, C205S118000, C205S125000, C205S291000, C205S296000, C210S748080

Reexamination Certificate

active

06977035

ABSTRACT:
A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.

REFERENCES:
patent: 5151170 (1992-09-01), Montgomery et al.
patent: 6391209 (2002-05-01), Belongia et al.
patent: 6444110 (2002-09-01), Barstad et al.
patent: 6596148 (2003-07-01), Belongia et al.
patent: 1 069 211 (2001-01-01), None
patent: 1 325 972 (2003-07-01), None
Ozkok et al.; “A Method Towards Infinite Bath Life for Acid Copper Electrolytes”; IPC/HKPCA'S 2003 International Printed Circuit & Electronics Assembly Fair, no month.

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