Method for electrolessly depositing metals using improved sensit

Coating processes – With pretreatment of the base

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

106 1, 427304, 427306, 427305, C23C 302

Patent

active

039820548

ABSTRACT:
Method for autocatalytically plating a dielectric surface with a metal such as nickel, cobalt or copper comprising sensitizing the surface with a sensitizing solution comprising both divalent tin, tetravalent tin and a substance furnishing either additional chloride ion (that is, in addition to what may be present in the sensitizer compounds) or bromide ion. The method also includes treating the sensitized surface with a catalyzing solution to provide catalytic nucleating centers and plating the metal on the catalyzed surface.

REFERENCES:
patent: 3379556 (1968-04-01), Chiecchi
patent: 3573973 (1971-04-01), Drotar et al.
patent: 3616296 (1971-10-01), Bernhardt et al.
patent: 3666527 (1972-05-01), Feldstein et al.
patent: 3698939 (1972-10-01), Leaman
patent: 3764488 (1973-10-01), Bernhardt et al.
patent: 3793072 (1974-02-01), Lando
patent: 3904792 (1975-09-01), Gulla et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for electrolessly depositing metals using improved sensit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for electrolessly depositing metals using improved sensit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for electrolessly depositing metals using improved sensit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1414476

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.