Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener
Patent
1994-02-28
2000-03-28
Utech, Benjamin L.
Coating processes
With pretreatment of the base
Preapplied reactant or reaction promoter or hardener
427437, 4274431, B05D 304
Patent
active
060428899
ABSTRACT:
An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest. Significantly, by using an appropriate ratio of the concentration of the metal ions in solution to the concentration of the mediator ions in solution, and depending upon which mediator ions are used, the inventive bath composition serves to electrolessly deposit the metal of interest onto the substrate surface of interest, with the resulting deposited metal containing less than or equal to about 3.0 atomic percent, or less than or equal to about 2.0 atomic percent, or even less than or equal to about 1.0 atomic percent, of the corresponding mediator metal.
REFERENCES:
patent: 2872346 (1959-02-01), Miller
patent: 3431120 (1969-03-01), Weisenberger
patent: 3485643 (1969-12-01), Zeblisky et al.
patent: 3637386 (1972-01-01), De Ruig et al.
patent: 3704156 (1972-11-01), Foley, Jr. et al.
patent: 3870526 (1975-03-01), Pearlstein
patent: 3942983 (1976-03-01), Di Blas et al.
patent: 4113484 (1978-09-01), Lelental et al.
patent: 4143186 (1979-03-01), Davis
patent: 4209331 (1980-06-01), Kukanskis et al.
patent: 4255194 (1981-03-01), Hough et al.
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4279948 (1981-07-01), Kukanskis et al.
patent: 4325990 (1982-04-01), Ferrier
patent: 4617205 (1986-10-01), Darken
patent: 4684550 (1987-08-01), Milius et al.
patent: 4818286 (1989-04-01), Jagannathan et al.
patent: 4877450 (1989-10-01), Brasch
patent: 5158604 (1992-10-01), Morgan et al.
Ballard Gerald Lee
Gaudiello John Gerard
Fraley Lawrence R.
International Business Machines - Corporation
Tiegerman Bernard
Utech Benjamin L.
LandOfFree
Method for electrolessly depositing a metal onto a substrate usi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for electrolessly depositing a metal onto a substrate usi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for electrolessly depositing a metal onto a substrate usi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1324088