Method for electroless plating on nonconductive substrates using

Details Method for electroless plating on nonconductive substrates using Method for electroless plating on nonconductive substrates using

1977-12-16

1980-01-08

Smith, John D.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

106 111, 427305, 427306, C23C 302

Patent

active

041827848

ABSTRACT:
A tin-palladium catalyst useful for electroless deposition of metals, such as copper or nickel, onto a nonconductive substrate, said catalyst containing a much lower concentration of halide ions than similar compositions presently known, or being completely free of halide ions. The tin-palladium catalyst can be prepared from nonhalide salts using a hydroxy substituted organic acid to stabilize the system.

REFERENCES:
patent: 3607352 (1971-09-01), Fadgen et al.
patent: 3904792 (1975-09-01), Gulla et al.
patent: 4001470 (1977-01-01), Berge
patent: 4061588 (1977-12-01), Gulla

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