Method for electroless plating gold directly on tungsten or moly

Coating processes – With post-treatment of coating or coating material – Heating or drying

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427 89, 427 92, 427 98, 427437, 106 1, 427383C, C23C 300

Patent

active

039938085

ABSTRACT:
Gold is directly plated onto tungsten or molybdenum by an electroless plating process using a plating solution including a gold compound and having pH not less than 8, and desirably not less than 9.

REFERENCES:
patent: 3162512 (1964-12-01), Robinson
patent: 3230098 (1968-01-01), Robinson
patent: 3266929 (1966-08-01), Lareau et al.
patent: 3396042 (1968-08-01), Duva
patent: 3589916 (1971-06-01), McCormack
patent: 3664868 (1972-05-01), Davis et al.

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