Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1997-12-24
2000-07-11
Talbot, Brian K.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427125, 427304, 427328, 427354, 427405, 427437, 4274431, B05D 512
Patent
active
060869461
ABSTRACT:
Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and subsequently treating the substrate with a diluted sulfuric acid solution. The substrate is rinsed between each one of the treatments, and after the final rinse following treatment with diluted sulfuric acid, the substrate is immersed in a gold deposition solution whereby gold is deposited on the exposed surfaces of the copper circuit features on a substrate. The process embodying the present invention provides a method for depositing gold on high density copper conductor lines or pads, even in areas of the surface in which the conductors are spaced apart 2.0 mil or less, without cleaning or removing the palladium seed from the surface.
REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3162512 (1964-12-01), Robinson
patent: 3396042 (1968-08-01), Duva
patent: 3468676 (1969-09-01), Schneble, Jr. et al.
patent: 3562038 (1971-02-01), Shipley, Jr. et al.
patent: 4027055 (1977-05-01), Schneble, Jr.
patent: 4305975 (1981-12-01), Ikari et al.
patent: 4337091 (1982-06-01), El-Shazly et al.
patent: 4574094 (1986-03-01), DeLuca et al.
patent: 4863758 (1989-09-01), Rhodenizer
patent: 4869930 (1989-09-01), Clarke et al.
patent: 5167992 (1992-12-01), Lin et al.
patent: 5213841 (1993-05-01), Gulla et al.
patent: 5380560 (1995-01-01), Kaja et al.
Ballard Gerald L.
Edwards Robert D.
Gaudiello John G.
Markovich Voya R.
Fraley Lawrence R.
International Business Machines - Corporation
Talbot Brian K.
LandOfFree
Method for electroless gold deposition in the presence of a pall does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for electroless gold deposition in the presence of a pall, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for electroless gold deposition in the presence of a pall will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-539670