Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined
Patent
1986-08-06
1987-06-09
Smith, John D.
Coating processes
Measuring, testing, or indicating
Thickness or uniformity of thickness determined
427 97, 427 98, 427305, 427437, 4274431, C23C 1840
Patent
active
046719687
ABSTRACT:
A method of electrolessly depositing copper onto a suitably prepared substrate surface is disclosed in which passivity to an otherwise autocatalytic electroless depositing solution is cured by application of a cathodic current for a brief period of time until autocatalytic deposition commences. The method is suitable for coating surfaces which per se are passive to the depositing solution as well as for coating surfaces which normally are receptive to the autocatalytic deposition and which have been so coated up to a certain point where interruption of the plating thereafter renders the surface passive to further deposition.
REFERENCES:
patent: 2644787 (1953-07-01), Bonn
patent: 3243361 (1966-03-01), Clark
patent: 3264199 (1966-08-01), Fassell
patent: 3303111 (1967-02-01), Peach
patent: 3485725 (1969-12-01), Koritzky
patent: 4209331 (1980-06-01), Kukanskis
patent: 4265943 (1981-05-01), Goldstein
patent: 4391841 (1983-07-01), Zeblisky
patent: 4459184 (1984-07-01), Kukanskis
patent: 4478690 (1984-10-01), Scholtens
patent: 4482596 (1984-11-01), Gulla
MacDermid Incorporated
Smith John D.
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