Method for electroless deposition of copper on conductive surfac

Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined

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427 97, 427 98, 427305, 427437, 4274431, C23C 1840

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active

046719687

ABSTRACT:
A method of electrolessly depositing copper onto a suitably prepared substrate surface is disclosed in which passivity to an otherwise autocatalytic electroless depositing solution is cured by application of a cathodic current for a brief period of time until autocatalytic deposition commences. The method is suitable for coating surfaces which per se are passive to the depositing solution as well as for coating surfaces which normally are receptive to the autocatalytic deposition and which have been so coated up to a certain point where interruption of the plating thereafter renders the surface passive to further deposition.

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