Coating processes – Immersion or partial immersion – Chemical compound reducing agent utilized
Patent
1983-12-15
1985-05-28
Smith, John D.
Coating processes
Immersion or partial immersion
Chemical compound reducing agent utilized
106 123, 106 126, 427 98, C23C 302
Patent
active
045200521
ABSTRACT:
A method for electroless copper-plating comprising immersing a surface to be plated in a conventional bath of an alkaline aqueous solution of a cupric salt, a complexing agent for cupric (II) ions and reducing agents which additionally contain an oxide inclusion preventing agent of the formula
REFERENCES:
patent: 3329512 (1967-07-01), Shipley
patent: 4171225 (1979-10-01), Molenaar
patent: 4211564 (1980-07-01), Oka
Saubestre, "Stabilizing Electroless Copper Solutions", Plating, June 1972, p. 563-566.
Concise Chemical and Technical Dictionary, Edited by Bennett, Chemical Publishing Co., 1974, pp. 92, 776, 669.
Persson Jan O.
Skowronek Jerzy
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