Method for electroless copper plating

Details Method for electroless copper plating Method for electroless copper plating

1975-04-18

1977-01-11

Kendall, Ralph S.

Coating processes

Immersion or partial immersion

427305, 427306, 106 1, 427437, C23C 302

Patent

active

040027864

ABSTRACT:
This invention provides a method for electroless copper plating comprising: providing an electroless copper plating bath composition which comprises 0.005 to 0.3 mole per liter of a water soluble copper compound, 0.005 to 0.6 mole per liter of a cupric complexing agent, 0.02 to 3.0 mole per liter of formaldehyde, 0.01 to 1000 milligram per liter of additive agent selected from the group consisting of 2,2'-dipyridyl, 2,9-dimethyl-1,10-phenanthroline and 2-(2-phridyl)-benzimidazole, and alkaline compound to hold the pH of said aqueous solution 10.5 to 14 and immersing a material having catalytic action at the surface into said electroless copper plating bath composition kept at a temperature of 70.degree. to 90.degree. C whereby copper film with a high mechanical strength is deposited on said material.

REFERENCES:
patent: 3377174 (1968-04-01), Torigai
patent: 3649350 (1972-03-01), Agens
patent: 3650777 (1972-03-01), Schneble
patent: 3754940 (1973-08-01), Kadison

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