Method for electrically modeling a semiconductor package

Details Method for electrically modeling a semiconductor package Method for electrically modeling a semiconductor package

1995-06-15

1997-12-02

Trans, Vincent N.

Boots, shoes, and leggings

364488, G06F 1750

Patent

active

056943440

ABSTRACT:
A method of electrically modeling a semiconductor package is provided. The method reduces computation time for mutual inductance calculations between interconnect lines of the semiconductor package. Only interconnect within a predetermined distance of an interconnect line being modeled is calculated for mutual inductance. The predetermined distance is selected such that any interconnect line greater than the predetermined distance away from the interconnect line being modeled produces a negligible or small mutual inductance. This greatly reduces the number of calculations for semiconductor packages having a large number of interconnect lines. Each interconnect line modeled is broken into segments for calculating mutual inductance. An algorithm is used that calculates the mutual inductance between a pair of arbitrarily oriented straight line metal segments. The algorithm requires a single integration which significantly reduces computation time when compared with systems solving Maxwell's equation in three dimensions.

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"Methods of Calculation of Electrical Parameters for Electronic Packaging Applications" by Michael R. Scheinfein and Olgierd A. Palusinski, ISSN 0740-6797/88, copyright 1988 The Society for Computer Stimulation, vol. 4, No. 3, pp.187-254.

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