Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2007-08-06
2011-10-25
Ward, Jessica L (Department: 1735)
Metal fusion bonding
Process
Plural joints
C228S180210, C438S612000, C438S613000
Reexamination Certificate
active
08042724
ABSTRACT:
A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.
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Manessis Dionysios
Neumann Alexander
Ostmann Andreas
Patzelt Rainer
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung
Kinberg Robert
Ma Christopher
Patel Devang R
Technische Universitaet Berlin
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