Patent
1988-08-02
1990-04-17
Miller, Stanley D.
350339R, G02F 1133
Patent
active
049174665
ABSTRACT:
The invention provides a very efficient and reliable method for electrically connecting the electrodes of an electronic device, e.g., IC chips, and the electrodes of, for example, a glass-made circuit board substrate with good repairability. Thus, the electrodes of the IC chip are each first coated with an electroconductive thermally meltable adhesive resinous composition to form a resinous bump, the IC chip is mounted on the substrate with the adhesive-coated electrodes contacting with the respective electrodes of the substrate, and remelting and then solidifying the resinous bumps so that the electrodes are bonded and electrically connected together. As compared with the conventional methods in which an electroconductive thermosetting resinous composition is used for the bumps on the electrodes, the electrical connection can be obtained with a smaller thermal effect and good replaceability of the IC chip found unacceptable with an acceptable one.
REFERENCES:
patent: 4362903 (1982-12-01), Eichelberger et al.
patent: 4413257 (1983-12-01), Kramer et al.
patent: 4474432 (1984-10-01), Takamatsu et al.
patent: 4643526 (1987-02-01), Watanabe et al.
Hayashi Osami
Kodama Naoki
Nakamura Akio
Saita Hirofumi
Gross Anita Pellman
Miller Stanley D.
Shin-Etsu Polymer Co. Ltd.
LandOfFree
Method for electrically connecting IC chips, a resinous bump-for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for electrically connecting IC chips, a resinous bump-for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for electrically connecting IC chips, a resinous bump-for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1047975