Method for electrically and mechanically connecting at least two

Details Method for electrically and mechanically connecting at least two Method for electrically and mechanically connecting at least two

1993-01-08

1996-04-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29843, 156 52, 174259, 174262, 252511, 252514, H05K 336

Patent

active

055028896

ABSTRACT:
A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

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