Cleaning and liquid contact with solids – Processes – Including regeneration – purification – recovery or separation...
Patent
1994-11-10
1996-01-09
Silbaugh, Jan H.
Cleaning and liquid contact with solids
Processes
Including regeneration, purification, recovery or separation...
134 30, 134 31, 252164, 252170, B08B 500, B08B 704, C23G 5024, C23G 5032
Patent
active
054825636
ABSTRACT:
A distillable, non-azeotropic solvent mixture for electronic assembly cleaning in order to adequately remove solder flux and other residues traditionally removed using CFC-based azeotropes. The mixture is heated to at least the boiling point of component A but less than the boiling point of component B. Component A vaporizes (102), forming a vapor layer above the mixture (103). Condensing elements (101) near the top of the cleaning apparatus condense the vapor (102), returning it to the heated mixture (103) to be vaporized again. The assembly (104) to be cleaned is lowered through the vapor and then immersed in the mixture (103) before being positioned in the vapor (102).
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Hagner Lawrence R.
Pfahl, Jr. Robert C.
Wrezel James A.
Bolvin Kenneth W.
Chaudhry Saeed
Dockrey Jasper W.
Motorola Inc.
Silbaugh Jan H.
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