Method for drying substrates

Details Method for drying substrates Method for drying substrates

1999-03-10

2000-10-10

Gravini, Stephen

Drying and gas or vapor contact with solids

Material treated by electromagnetic energy

Microwave energy

34267, 34420, G26B 334

Patent

active

061288292

ABSTRACT:
In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.

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