Method for drilling thru-holes on a lamination substrate and a s

Details Method for drilling thru-holes on a lamination substrate and a s Method for drilling thru-holes on a lamination substrate and a s

1994-08-04

1996-04-16

Bishop, Steven C.

Cutting by use of rotating axially moving tool

Processes

Bit detachable

428458, 428463, B23B 3500, B23B 1508, B23B 2706

Patent

active

055076033

ABSTRACT:
First of all, a high molecular sheet comprising a composite whose principal component is a special water soluble high molecular compound, or a multilayer sheet wherein a water soluble high molecular layer is piled on sheet material is prepared. Then, said sheet is layered on the entry side of a lamination substrate comprising insulating material and metallic foil. In this state, thru-holes are formed in the lamination substrate through said sheet. When forming thru-holes, said water soluble high molecular compound serves as a lubricant so as to extend drill life. In addition, it is possible to drill a lot of substrates, which are layered, at one time, resulting in the improvement of production efficiency.

REFERENCES:
patent: 4781495 (1988-11-01), Hatch et al.
patent: 4929370 (1990-05-01), Hatch et al.
patent: 4954200 (1990-09-01), Trewiler
patent: 5082402 (1992-01-01), Gaku et al.

Affiliated with

Also associated with

Rating

Method for drilling thru-holes on a lamination substrate and a s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for drilling thru-holes on a lamination substrate and a s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for drilling thru-holes on a lamination substrate and a s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-320835