Method for drilling reference holes in multi-layer printed wirin

Details Method for drilling reference holes in multi-layer printed wirin Method for drilling reference holes in multi-layer printed wirin

1985-11-14

1987-11-24

Bilinsky, Z. R.

Gear cutting, milling, or planing

Milling

Process

408 1R, B23C 300

Patent

active

047085452

ABSTRACT:
A method for drilling reference holes in a multi-layer printed wiring board assembly, in which drilling position marks provided on inner-layer circuit board in the assembly are roughly detected through each of two outer-layer boards of the assembly, a spot-facing is made with respect to the outer-layer boards at roughly detected points of the marks, and thereafter the marks are precisely detected at the faced spots. Positions for drilling the reference holes can be thereby determined at the spots precisely in close proximity to the internally provided drilling position marks, to allow the drilling performed very accurately in simpler and economical manner.

REFERENCES:
patent: 4432037 (1984-02-01), Brabetz
patent: 4485964 (1984-12-01), Yamada et al.
patent: 4536239 (1985-08-01), Benson

Affiliated with

Also associated with

Rating

Method for drilling reference holes in multi-layer printed wirin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for drilling reference holes in multi-layer printed wirin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for drilling reference holes in multi-layer printed wirin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2422245