Method for doping strained heterojunction semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

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257 19, 257187, 257197, 257 51, 257 65, 257565, 437 20, 437 22, 437 31, 437966, 437976, H01L 2906, H01L 21265

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active

055656900

ABSTRACT:
A method for doping a strained heterojunction semiconductor device includes heating a substrate (16) having a strained mono-crystalline semiconductor region (22) to a temperature above room temperature. While the substrate (16) is heated, dopants are ion implanted into the strained mono-crystalline semiconductor region (22) to minimize implant related damage. Thereafter the substrate (16) is heated under non-steady state conditions for a time sufficient to activate the implanted dopant and anneal implant related damage while minimizing relaxation of the strained heterojunction.

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Lie et al., Steady-State Versus Rapid Thermal Annealing of Phosphorus-Implanted Pseudomorphic Si(100)/Ge.sub.0.12 Si.sub.0.88, Apr. 1994, SRC Pub C94167, pp. 1-6.

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