Method for dissipating heat from an integrated circuit

Details Method for dissipating heat from an integrated circuit Method for dissipating heat from an integrated circuit

1996-10-03

1998-08-04

Tolin, Gerald P.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 257719, 361704, 361719, H05K 720

Patent

active

057875766

ABSTRACT:
A heat sink apparatus dissipates heat from an integrated circuit which is connected to a printed circuit board. A support member is connected to the circuit board for supporting the integrated circuit with respect to the circuit board. A metal tab in thermal communication with the integrated circuit extends from the support member in a plane substantially parallel to the circuit board. An electrically insulating thermally conductive compressible pad is positioned in contact with the metal tab for receiving heat from the tab when compressed. A thermally conductive housing is positioned adjacent the pad for compressing the pad against the tab and for receiving heat from the pad when compressed. The housing includes a plurality of fins extending therefrom for heat dissipation. A method for dissipating heat from an integrated circuit which is connected to a printed circuit board is also provided.

REFERENCES:
patent: 4756081 (1988-07-01), Penn
patent: 5061191 (1991-10-01), Casciotti
patent: 5175613 (1992-12-01), Barker, III
patent: 5305185 (1994-04-01), Samarov et al.
patent: 5424919 (1995-06-01), Heilbronner
patent: 5430609 (1995-07-01), Kikinis
patent: 5473510 (1995-12-01), Dozier, II
patent: 5590026 (1996-12-01), Warren

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