Metal fusion bonding – Process – Preplacing solid filler
Patent
1997-05-15
1999-06-08
Ryan, Patrick
Metal fusion bonding
Process
Preplacing solid filler
228224, B23K 3512, B23K 3102
Patent
active
059098392
ABSTRACT:
A method is provided for applying a fluid to a plurality of locations on a non-planar substrate. The apparatus used includes a movable base and an array of pins connected to the base. Each pin has a distal end which is vertically movable with respect to the base independently of the rest of the array of pins. Each distal end is adapted to transfer fluid to a location on the substrate by having a greater affinity for the fluid than the fluid has for itself and a lesser affinity for the fluid than the fluid has for the substrate. Accordingly, the distal ends may be dipped in the fluid and moved into contact with the substrate such that the distal ends may collapse toward the base as the distal ends engage the substrate to facilitate further movement of the base toward the substrate for application of fluid to each of the plurality of locations.
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"DCC Connectors Are The Next Generation", Miraco, Inc., Connection Ideas, vol. 7, No. 1, 1996, p. 5.
"Automatic Flux Applicator", IBM Technical Disclosure Bulletin, vol. 34, No. 2, Jul. 1991, pp. 356-357.
Belke, Jr. Robert Edward
Todd Michael George
Trublowski John
Ford Motor Company
Gamino Carlos J.
Malleck Joseph W.
May Roger L.
Ryan Patrick
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