Method for directly electroplating a dielectric substrate and pl

Details Method for directly electroplating a dielectric substrate and pl Method for directly electroplating a dielectric substrate and pl

1989-11-21

1991-12-10

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

205158, C25D 502, C25D 554

Patent

active

050715178

ABSTRACT:
A method for the direct electroplating of a non-conducting substrate and plated substrates so produced are disclosed wherein the non-conducting substrate is first treated with a non-acidic aqueous salt solution containing a micro-fine colloidal distribution of a noble or precious metal and tin to form a strongly adsorbed, uniform, conducting layer of micro-fine colloidal metal cayatalyst upon at least a portion of the substrate surface. The conducting layer is then electroplated directly without the need for electroless plating, conversion coatings, or preferential plating solution additives.

REFERENCES:
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3904792 (1975-09-01), Gulla et al.
patent: 3961109 (1976-06-01), Kremer et al.
patent: 4061588 (1977-12-01), Gulla
patent: 4448804 (1984-05-01), Amelio et al.
patent: 4481236 (1984-11-01), Forsterling
patent: 4604299 (1986-08-01), De Luca et al.
patent: 4891069 (1990-01-01), Holtzman et al.
patent: 4933010 (1990-06-01), Okabayashi
Matijevic, E. et al., The Characterization of the Stannous Chloride/Palladium Chloride Catalysts for Electroless Plating, Plating and Surface Finishing, (reprint), Oct. 1975.

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