Method for directly depositing metal containing patterned films

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

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427270, 427272, 427282, 427377, 427380, 4273831, 427404, 4274193, 427552, 427558, 427581, 427597, H05H 100

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055343120

ABSTRACT:
A photoresist-free method for making patterned films of metal oxides, metals, or other metal containing compounds is described. The method involves applying an amorphous film of a metal complex to a substrate. The film may be conveniently applied by spin coating using standard industry techniques. The metal complex used is photoreactive and undergoes a low temperature chemical reaction in the presence of light of a suitable wavelength. The end product of the reactions depends upon the atmosphere in which the reactions take place. Metal oxide films may be made in air. Patterned films may be made by exposing only selected portions of the film to light. Patterns of two or more materials may be laid down from the same film by exposing different parts of the film to light in different atmospheres. The resulting patterned film is generally planar. Separate planarization steps are not generally required.

REFERENCES:
patent: 4952556 (1990-08-01), Mantese et al.
patent: 5064685 (1991-11-01), Kestenbaum et al.
patent: 5277980 (1994-01-01), Mino
S. L. Blair et al., Solid-state photochemistry of platinum (II) methylazide complexes as thin films on Si (111) surfaces: photolithography of platinum films, Journal of Materials Science 29 (1994) 2143-2146 (no month available).
B. J. Palmer et al., Photolithography of amorphous films of (n.sup.5 -C.sub.5 H.sub.5).sub.2 Ti(N.sub.3).sub.2 on silicon (111) resulting in TiO.sub.2 : the mechanism of the photodeposition reaction, Journal of Materials Science 28 (1993) 6013-6020 (no month available).
Douglas G. Bickley et al., Solid state photochemistry of (C.sub.8 H.sub.12)Pt(N.sub.3).sub.2 as thin films on Si(111) surfaces, J. Photochem. Photobiol. A: Chem., 67 (1992) 181-186 (no month available).
Teresa W. H. Ho et al., Solid state photochemistry of (C.sub.2 H.sub.4 (Ph.sub.2 P).sub.2)M(N.sub.3).sub.2 (M=Ni, Pd, Pt) on Si(111) surfaces, J. Photochem. Photobiol. A: Chem., 69 (1992) 229-235 (no month available).
Sharon L. Blair et al., The photochemical production of nickel films from thin films of the inorganic nickel complexes trans-NiN.sub.4 X.sub.2 (N.sub.2 =Et.sub.2 NC.sub.2 H.sub.4 NH.sub.2, MeHNC.sub.2 H.sub.4 NMeH; X=NO.sub.2, NO.sub.3, NCS), J. Photochem. Photobiol. A: Chem., 81 (1994) 183-191 (no month available).

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