Method for directly debonding sliders during single slider...

Details Method for directly debonding sliders during single slider... Method for directly debonding sliders during single slider...

2006-03-28

2006-03-28

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603120, C029S603150, C029S603160, C029S417000, C216S022000, C216S039000, C216S041000, C260S66500B, C260S66500B, C260S66500B, C260S66500B, C260S66500B, C451S005000, C451S041000

Reexamination Certificate

active

07017257

ABSTRACT:
A process for directly debonding sliders during single slider processing includes placing the sliders in pockets in a divider with one surface of each slider contacting a tape. A planerization material encapsulates the portions of the sliders which are not in contact with the tape. The planerization material is cured and the assembly is bonded to a process carrier. After ABS are etched into the sliders, the sliders are debonded by heating, cleaned, and inspected. The divider is removed from the carrier with the sliders still attached to the divider by the planerization material. The divider is then sandwiched between two lids to form a shim stack to enhance removal of the planerization material. The planerization material is removed in a hot solvent ultra-sonic bath and the lids are then removed for additional cleaning and inspection of the sliders.

REFERENCES:
patent: 5468177 (1995-11-01), Kindler et al.
patent: 6129855 (2000-10-01), Sawada et al.
patent: 6287475 (2001-09-01), Fukushima et al.
patent: 6806725 (2004-10-01), Tsui et al.
patent: 2000285429 (2000-10-01), None
“A silicon microactuator using integrated microfabrication technology”; Lu, Y.; Yang, J.P.; Chen, J.; Chen, S.X.; Magnetics, IEEE Transactions on vol. 39; Sep. 2003, pp.: 2240-2242.

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