Metal fusion bonding – Process – Diffusion type
Patent
1983-03-28
1990-01-02
Ramsey, Kenneth J.
Metal fusion bonding
Process
Diffusion type
228198, 22826317, B23K 2014
Patent
active
048907847
ABSTRACT:
Diffusion bonding of aluminum alloys is performed using a thin alloy interlayer placed between mating surfaces of the alloy members to be bonded, the interlayer having a specific composition which is dependent upon the composition of the alloy members, the diffusion bonding temperature, the interdiffusion rates of the alloy members compared with the interlayer, and the solid state diffusion rate of the interlayer into the alloy members. The process is preferably further characterized by isothermal solidification of the interlayer after the diffusion bonding temperature has been reached.
REFERENCES:
patent: 2095807 (1937-10-01), Gier
patent: 3180022 (1965-04-01), Briggs
patent: 3339269 (1967-09-01), Hanink
patent: 3373482 (1968-03-01), Miller
patent: 3373483 (1968-03-01), Miller
patent: 3581382 (1971-06-01), Wells et al.
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 3935986 (1976-02-01), Lattari et al.
patent: 3937387 (1976-02-01), Fletcher et al.
patent: 3993238 (1976-11-01), Brook et al.
patent: 4005988 (1977-02-01), Paulonis et al.
patent: 4046305 (1977-09-01), Brown et al.
patent: 4122992 (1978-10-01), Duvall et al.
patent: 4174232 (1979-11-01), Lenz et al.
patent: 4222797 (1980-09-01), Hamilton et al.
patent: 4240574 (1980-12-01), Schmatz et al.
patent: 4331286 (1982-05-01), Tamamura et al.
Metal Handbook, 9th Ed., 1973, ASM Handbook Committee, page 65, Aluminum 1100.
Ramsey Kenneth J.
Rockwell International Corporation
Silberberg Charles T.
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