Method for diffusing metals into substrates

Details Method for diffusing metals into substrates Method for diffusing metals into substrates

1978-06-01

1980-06-03

Esposito, Michael F.

Coating processes

Electrical product produced

Piezoelectric properties

4271263, 427167, 350 9612, 427226, 427229, 427162, G02B 514, B05D 512

Patent

active

042062519

ABSTRACT:
The specification describes a process for diffusing a metal into a substrate which may be either a semiconductor material or a dielectric material. The substrate is first coated with a liquid composition comprising organo-metallic solutions of the desired metal and silica. The coated substrate is then heated at an elevated temperature for a period of time sufficient to cause the organic portion of the solution to decompose, thereby leaving a composite film comprising an oxide of the desired metal and SiO.sub.2. Upon further heating, the metal from the metal oxide diffuses into the substrate. The residual composite film may be left in place or removed.

REFERENCES:
patent: 3163553 (1964-12-01), Commanday
patent: 3834939 (1974-09-01), Beyer
patent: 3877982 (1975-04-01), Coldren
patent: 3928225 (1975-12-01), Schafer
patent: 3964085 (1976-06-01), Kahng
patent: 4017271 (1977-04-01), Gliemeroth
patent: 4038111 (1977-07-01), Dumas
patent: 4048350 (1977-09-01), Glang
Minakata et al., "LiNbTa.sub.1-x O.sub.3 . . . Sputtered Films", App. Physics Letters, vol. 26, No. 7, pp. 395-398, (Apr., 1975).
Burns et al., Application of Li.sub.2 O . . . Waveguides Applied Physic Letters, Jul. 1978, vol. 33(1), pp. 70-72.

Affiliated with

Also associated with

Rating

Method for diffusing metals into substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for diffusing metals into substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for diffusing metals into substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-716194