Method for dielectrically heating an adhesive

Electric heating – Capacitive dielectric heating – Bonding

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219769, 219779, 156 64, 1562744, 1562748, 1563802, H05B 650

Patent

active

057509700

ABSTRACT:
A method of heating an adhesive including the steps of placing a dielectrically heatable adhesive between first and second members. A high frequency electric field is applied between the first and second members sufficient to dielectrically heat the adhesive. The surface temperature of the first member is measured in the vicinity near the adhesive. The electric field is removed after the measured temperature reaches a predefined amount. The invention anticipates measuring the infrared radiation emitted from the surface of the first member and is measured with an infrared detector. A controller receives the measured infrared radiation and compares it to stored values. After the measured temperature reaches a predefined value or values, the controller sends a signal to an RF generator to remove the electric fields.

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patent: 5518560 (1996-05-01), Li
patent: 5575869 (1996-11-01), Fujiwara et al.

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