Electric heating – Capacitive dielectric heating – Bonding
Patent
1998-02-02
1999-05-25
Leung, Philip H.
Electric heating
Capacitive dielectric heating
Bonding
219779, 1562744, 1563802, H05B 650
Patent
active
059067667
ABSTRACT:
A method of heating an adhesive including the steps of placing a dielectrically heatable adhesive between first and second members. A high frequency electric field is applied between the first and second members sufficient to dielectrically heat the adhesive. The surface temperature of the first member is measured in the vicinity near the adhesive. The electric field is removed after the measured temperature reaches a predefined amount. The invention anticipates measuring the infrared radiation emitted from the surface of the first member and is measured with an infrared detector. A controller receives the measured infrared radiation and compares it to stored values. After the measured temperature reaches a predefined value or values, the controller sends a signal to an RF generator to remove the electric fields.
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Ford Global Technologies Inc.
Leung Philip H.
Porcari Damian
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