Method for dicing semiconductor substrates using an excimer lase

Details Method for dicing semiconductor substrates using an excimer lase Method for dicing semiconductor substrates using an excimer lase

1990-09-10

1992-09-29

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437173, 437209, H01L 21302

Patent

active

051513897

ABSTRACT:
Method and apparatus for using deep ultraviolet excimer laser beams to dice semiconductor substrates, such as sapphire, with or without integrated circuitry, by establishing guided relative motion between the beam and the substrate to achieve ablative photodecomposition with the angle between the beam and the substrate being approximately five (5) degrees out of normal.

REFERENCES:
patent: 4851371 (1989-07-01), Fisher et al.
patent: 4865686 (1989-09-01), Sinohara
patent: 4964212 (1990-10-01), Deroux-Dauphin et al.

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