Method for dicing semiconductor substrates using a laser scribin

Details Method for dicing semiconductor substrates using a laser scribin Method for dicing semiconductor substrates using a laser scribin

1991-05-15

1993-02-09

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

156651, 156652, 437173, H01L 2180

Patent

active

051852950

ABSTRACT:
The silicon substrate in which mesa semiconductor elements are formed is scribed along dicing lines by a laser. The resolidified silicon, which failed to vaporize during scribing, is etched away by sodium hydroxide solution. As a result, the silicon substrate is separated into a plurality of mesa semiconductor pellets. These pellets undergo chemical etching with a fluoric and nitric acid mixture to smooth the cut surfaces.

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patent: 4383886 (1983-05-01), Nakamura et al.
patent: 4978421 (1990-12-01), Bassous et al.

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