Method for dicing semiconductor substrate

Details Method for dicing semiconductor substrate Method for dicing semiconductor substrate

2006-11-14

2010-11-23

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S110000, C438S462000, C438S464000, C257SE21218, C257SE21508, C257SE21599, C257SE23004, C257SE23067

Reexamination Certificate

active

07838331

ABSTRACT:
A device separated from a wafer includes: a chip having a sidewall, which is provided by a dicing surface of the wafer in a case where the device is separated from the wafer; and a protection member disposed on the sidewall of the chip for protecting the chip from being contaminated by a dust from the dicing surface. In the device, the dicing surface of the wafer is covered with the protection member so that the chip is prevented from contaminated with the dust.

REFERENCES:
patent: 3838501 (1974-10-01), Umbaugh
patent: 6063695 (2000-05-01), Lin et al.
patent: 6214703 (2001-04-01), Chen et al.
patent: 6429506 (2002-08-01), Fujii et al.
patent: 6551863 (2003-04-01), Johnson et al.
patent: 6992026 (2006-01-01), Fukuyo et al.
patent: 7067901 (2006-06-01), Farnworth et al.
patent: 7071012 (2006-07-01), Tan et al.
patent: 7071024 (2006-07-01), Towle et al.
patent: 7087460 (2006-08-01), Lee
patent: 7129114 (2006-10-01), Akram
patent: 7335576 (2008-02-01), David et al.
patent: 7396742 (2008-07-01), Fukuyo et al.
patent: 7435607 (2008-10-01), Nagai
patent: 7449396 (2008-11-01), Murata et al.
patent: 2004/0226927 (2004-11-01), Morikazu et al.
patent: 2005/0173387 (2005-08-01), Fukuyo et al.
patent: 2005/0181581 (2005-08-01), Fukuyo et al.
patent: 2005/0184037 (2005-08-01), Fukuyo et al.
patent: 2005/0189330 (2005-09-01), Fukuyo et al.
patent: 2005/0194364 (2005-09-01), Fukuyo et al.
patent: 2005/0202596 (2005-09-01), Fukuyo et al.
patent: 2005/0202651 (2005-09-01), Akram
patent: 2006/0011593 (2006-01-01), Fukuyo et al.
patent: 2006/0040473 (2006-02-01), Fukuyo et al.
patent: 2006/0160331 (2006-07-01), Fukuyo et al.
patent: 1 742 253 (2005-03-01), None
patent: 1-575-081 (2005-09-01), None
patent: A-48-52375 (1973-07-01), None
patent: A-50-37347 (1975-04-01), None
patent: A-62-063446 (1987-03-01), None
patent: A-05-283450 (1993-10-01), None
patent: A-06-005665 (1994-01-01), None
patent: A-6-77316 (1994-03-01), None
patent: A-07-321070 (1995-12-01), None
patent: A-2000-124163 (2000-04-01), None
patent: 2003-068832 (2003-03-01), None
patent: A-2004-128115 (2004-04-01), None
patent: WO 2005/098916 (2005-10-01), None
Office Action dated Mar. 10, 2008 in corresponding German Patent Application No. 10 2006 054 073.5 (and English translation).
Notice of Reason for Refusal mailed on January 26, 2010 in the corresponding Japanese patent application No. 2005-331210 (and English translation).

Affiliated with

Also associated with

Rating

Method for dicing semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for dicing semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for dicing semiconductor substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4232806