Method for dicing glass substrate

Details Method for dicing glass substrate Method for dicing glass substrate

2008-07-01

2008-07-01

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S113000, C438S460000, C257SE21506, C257SE21599

Reexamination Certificate

active

11473980

ABSTRACT:
A method for dicing a sheet workpiece includes the following steps. A base (10) is provided. A water-soluble adhesive (20) is coated onto the base, and the workpiece is placed on the water-soluble adhesive. The water-soluble adhesive is hardened so as to, fix the workpiece on the base. The workpiece is diced to form cut pieces. The hardened water-soluble adhesive dissolves in water. The present method reduces the deformation of the hardened water-soluble adhesive and may thus eliminate chipping. Accordingly, the present method can contribute significantly to improving the production yield.

REFERENCES:
patent: 4286051 (1981-08-01), Wagner
patent: 5972159 (1999-10-01), Uryu et al.
patent: 6040049 (2000-03-01), Tominaga et al.
patent: 6770960 (2004-08-01), Oohata
patent: 6872635 (2005-03-01), Hayashi et al.
patent: 6943047 (2005-09-01), Yanagisawa et al.

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