Method for dicing glass substrate

Details Method for dicing glass substrate Method for dicing glass substrate

2008-07-01

2008-07-01

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S113000, C438S460000, C257SE21506, C257SE21599

Reexamination Certificate

active

07393760

ABSTRACT:
A method for dicing a sheet workpiece includes the following steps. A base (10) is provided. A water-soluble adhesive (20) is coated onto the base, and the workpiece is placed on the water-soluble adhesive. The water-soluble adhesive is hardened so as to, fix the workpiece on the base. The workpiece is diced to form cut pieces. The hardened water-soluble adhesive dissolves in water. The present method reduces the deformation of the hardened water-soluble adhesive and may thus eliminate chipping. Accordingly, the present method can contribute significantly to improving the production yield.

REFERENCES:
patent: 4286051 (1981-08-01), Wagner
patent: 5972159 (1999-10-01), Uryu et al.
patent: 6040049 (2000-03-01), Tominaga et al.
patent: 6770960 (2004-08-01), Oohata
patent: 6872635 (2005-03-01), Hayashi et al.
patent: 6943047 (2005-09-01), Yanagisawa et al.

Affiliated with

Also associated with

Rating

Method for dicing glass substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for dicing glass substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for dicing glass substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2794866